Siemens Digital Industries Software announced the latest updates to its NX and NX X software from the Designcenter suite of product engineering software, including immersive engineering for mixed ...

Thermal simulation supports engineers who design electronic products, particularly those that dissipate substantial power. If the thermal-simulation tool is easy to use and provides clear results, ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Some of the important trends driving EV development are getting more than 200 miles out of a charge, pricing below $40,000, fast charging such as less than 30 minutes for an 80% charge, increasing ...

It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...