Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

TROY, Mich., Feb. 19, 2025 /PRNewswire/ -- Altair (Nasdaq: ALTR), a global leader in computational intelligence, is thrilled to announce the release of Altair® HyperWorks® 2025, a best-in-class design ...

“With HyperWorks 11.0, we have achieved even more extensive integration and automation of functions, freeing engineers to use their creativity and talents to innovate, rather than focusing the ...

While Windows-based systems have some tools available that can mimic a Unix-like environment, they often come with limitations to their capabilities, especially when working with large files.